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        "MRS Build All 后 postbuildStep 自动发版上云"
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        "MRS Build All 后 postbuildStep 自动发版上云"
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        "MRS Build All 后 postbuildStep 自动发版上云"
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        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS Build All 后 postbuildStep 自动发版上云"
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        "MRS Build All 后 postbuildStep 自动发版上云"
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        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
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        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS Build All 后 postbuildStep 自动发版上云"
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        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS Build All 后 postbuildStep 自动发版上云"
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        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
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        "修复 STMVER 查询时被 C55C 数据流挤丢的问题（STM32 端新增 STMQUIET=N 静音）",
        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS Build All 后 postbuildStep 自动发版上云"
      ]
    },
    {
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      "hexFileName": "WM_CH592_V3.1.10_20260520003156.hex",
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        "修复 STMVER 查询时被 C55C 数据流挤丢的问题（STM32 端新增 STMQUIET=N 静音）",
        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS Build All 后 postbuildStep 自动发版上云"
      ]
    },
    {
      "fileName": "WM_CH592_V3.1.9_20260520003005.bin",
      "hexFileName": "WM_CH592_V3.1.9_20260520003005.hex",
      "version": "3.1.9",
      "buildTime": "2026-05-20T00:30:05+08:00",
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        "修复 STMVER 查询时被 C55C 数据流挤丢的问题（STM32 端新增 STMQUIET=N 静音）",
        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS Build All 后 postbuildStep 自动发版上云"
      ]
    },
    {
      "fileName": "WM_CH592_V3.1.6_20260520001835.bin",
      "hexFileName": "WM_CH592_V3.1.6_20260520001835.hex",
      "version": "3.1.6",
      "buildTime": "2026-05-20T00:18:35+08:00",
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        "修复 STMVER 查询时被 C55C 数据流挤丢的问题（STM32 端新增 STMQUIET=N 静音）",
        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS postbuildStep 接入 release.py，编译后自动刷新 Latest 别名 / 触发上云"
      ]
    },
    {
      "fileName": "WM_CH592_V3.1.6_20260520001957.bin",
      "hexFileName": "WM_CH592_V3.1.6_20260520001957.hex",
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      "hexSha256": "cba6fdab93db5779a7abf8a4e7f64d5f978cd23844578137fd47436177b4139c",
      "changelog": [
        "修复 STMVER 查询时被 C55C 数据流挤丢的问题（STM32 端新增 STMQUIET=N 静音）",
        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS postbuildStep 接入 release.py，编译后自动刷新 Latest 别名 / 触发上云"
      ]
    },
    {
      "fileName": "WM_CH592_V3.1.6_20260520002204.bin",
      "hexFileName": "WM_CH592_V3.1.6_20260520002204.hex",
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      "sizeBytes": 112664,
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      "hexSha256": "cba6fdab93db5779a7abf8a4e7f64d5f978cd23844578137fd47436177b4139c",
      "changelog": [
        "修复 STMVER 查询时被 C55C 数据流挤丢的问题（STM32 端新增 STMQUIET=N 静音）",
        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS postbuildStep 接入 release.py，编译后自动刷新 Latest 别名 / 触发上云"
      ]
    },
    {
      "fileName": "WM_CH592_V3.1.6_20260520002625.bin",
      "hexFileName": "WM_CH592_V3.1.6_20260520002625.hex",
      "version": "3.1.6",
      "buildTime": "2026-05-20T00:26:25+08:00",
      "sizeBytes": 112664,
      "sha256": "b627f0e9951a18ff1a248a0b4a5650290f165216ef20e4ab2e0132e149c186d2",
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        "WM_CH592 Mesh 固件",
        "修复 STMVER 查询时被 C55C 数据流挤丢的问题（STM32 端新增 STMQUIET=N 静音）",
        "APP 端配套：查询版本时自动暂停 STM32/CH592 两端的 C55C 转发",
        "MRS Build All 后 postbuildStep 自动发版上云"
      ]
    },
    {
      "fileName": "WM_CH592_V3.1.5_20260519221527.bin",
      "hexFileName": "WM_CH592_V3.1.5_20260519221527.hex",
      "version": "3.1.5",
      "buildTime": "2026-05-19T22:15:27+08:00",
      "sizeBytes": 112664,
      "sha256": "b627f0e9951a18ff1a248a0b4a5650290f165216ef20e4ab2e0132e149c186d2",
      "hexSizeBytes": 705981,
      "hexSha256": "cba6fdab93db5779a7abf8a4e7f64d5f978cd23844578137fd47436177b4139c",
      "changelog": [
        "<!--",
        "下一版 CH592 固件的更新说明。每行一条，可用 `- ` 或 `* ` 起手（脚本会自动去掉符号）。",
        "发布脚本 `python release.py` 跑完后此文件会被自动移到 `release_notes/<版本号>.md`。",
        "->",
        "修复 BLE OTA 写入地址（IMAGE_B_START_ADD），解决 OTA 完成后 brick 的问题",
        "FFE1 快照 schema 0x02 上报固件版本 (APP_STATUS_FW_MAJOR/MINOR/PATCH)",
        "OTA 期间暂停 C55C 上报，END 前增加 300ms 延时确保 GATT 应答送达"
      ]
    }
  ]
}